Beam lead bonding apparatus and method for beam lead bonding defect detection

摘要

In the beam lead bonding apparatus for detecting a beam lead bonding failure according to the present invention, the beam head bonding current is detected by the control unit for the beam lead bonding failure detection of the head, the transducer, the beam lead bonding unit, the beam lead, the semiconductor chip, and the heater block. After sequentially passing through the feedback to the ground terminal of the control unit.;Therefore, the present invention improves the reliability of the process by detecting the intensity of the feedback current and determining the amount and defect of beam lead bonding.