Beam lead bonding apparatus detecting cutting failure of beam leads and method for bonding beam leads using the same

摘要

PURPOSE: A beam lead adhesion apparatus with a cut error detection function of a beam lead and an adhering method using the same are provided to prevent an inferior semiconductor by detecting a cutting stage of a beam lead. CONSTITUTION: A beam lead adhesion apparatus(100) is formed with a carrier boat loading portion(102), a transducer(104), a drive portion(106), a signal terminal(108), a capillary(110), and a control portion(112). A carrier boat is loaded on the carrier boat loading portion(102). The control portion(112) controls all operations of the beam lead adhesion apparatus(100). The transducer(104) is located on an upper portion of the carrier boat loading portion(102). The transducer(104) is driven by the drive portion(106). The capillary(110) is fixed to one side of the transducer(104). The capillary(108) is used for cutting a beam lead or adhering the beam lead to a bonding pad of a semiconductor chip. The signal terminal(108) is adhered to the transducer(104). A signal outputted from the signal terminal(108) is transmitted to the transducer(104) and the capillary(110).