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Total internal reflection holography method and apparatus for lithography on 3-D spherical shaped integrated circuit

机译:在3-d球形集成电路上进行光刻的全内反射全息照相方法和设备

摘要

A photolithograhic method and apparatus for exposure of a spherical shaped semiconductor substrate according to a mask pattern of a primary spherical object mask in the manufacture of a spherical semiconductor device is disclosed. A secondary mask is provided, the secondary mask having stored therein a hologram recorded from the primary spherical object mask and containing spherical mask pattern information. The spherical shaped semiconductor substrate is then positioned with respect to the secondary mask in preparation for a photolithographic exposure. Lastly, a reference beam is directed upon the secondary mask for enabling inverse scattering of the hologram to produce an inverse scattered holographic image photolithographic exposure of the spherical shaped semiconductor substrate.
机译:公开了一种用于在球形半导体器件的制造中根据初级球形物体掩模的掩模图案曝光球形半导体衬底的光刻方法和设备。提供了次级掩模,该次级掩模中存储有从初级球形物体掩模记录的全息图并且包含球形掩模图案信息。然后相对于第二掩模放置球形半导体衬底,以准备进行光刻曝光。最后,将参考光束引导到辅助掩模上,以使全息图能够反向散射,以产生球形半导体衬底的反向散射全息图像光刻曝光。

著录项

  • 公开/公告号US5949557A

    专利类型

  • 公开/公告日1999-09-07

    原文格式PDF

  • 申请/专利权人 BALL SEMICONDUCTOR INC.;

    申请/专利号US19980094761

  • 发明设计人 KARLTON POWELL;

    申请日1998-06-15

  • 分类号G03H1/02;

  • 国家 US

  • 入库时间 2022-08-22 02:07:21

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