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Porous conversion modulo of silicon substrate and formation manner null of porous silicon

机译:硅基板的多孔转换模及其形成方式

摘要

PURPOSE: To provide a method of forming a porous silicon layer having fine holes on a single crystal silicon substrate unifromly to the depth direction and with good control to the depth direction. ;CONSTITUTION: A high-energy ion beam 2 is emitted on a silicon substrate 1 and thereafter, a surface layer of the substrate 1 is modified into a porous silicon layer 3 using an anodizing method. Thereby, as the obtained layer 3 utilizes an emission defect due to the incided ion beam 2, which is the material of the layer 3, the porous silicon layer 3 having a desired hole diameter can be formed by controlling the kind of the ion beam, the energy and an injection amount. Moreover, it becomes possible to obtain the porous silicon layer 3, which has not the depth direction profile of the hole diameter and is very uniform.;COPYRIGHT: (C)1994,JPO&Japio
机译:目的:提供一种在单晶硅基板上沿深度方向唯一地且在深度方向上具有良好控制的形成具有细孔的多孔硅层的方法。 ;组成:高能离子束2发射到硅衬底1上,然后,使用阳极氧化方法将衬底1的表面层改性为多孔硅层3。从而,由于获得的层3利用了由于作为层3的材料的离子束2的入射而产生的发射缺陷,所以可以通过控制离子束的种类来形成具有期望的孔径的多孔硅层3,能量和注入量。而且,可以获得多孔硅层3,该多孔硅层3没有孔径的深度方向轮廓并且非常均匀。;版权所有:(C)1994,JPO&Japio

著录项

  • 公开/公告号JP3061973B2

    专利类型

  • 公开/公告日2000-07-10

    原文格式PDF

  • 申请/专利权人 シャープ株式会社;

    申请/专利号JP19930056111

  • 发明设计人 大野 公隆;赤木 与志郎;

    申请日1993-03-16

  • 分类号H01L21/31;

  • 国家 JP

  • 入库时间 2022-08-22 02:04:34

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