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Solder bridge inspection manner and its device null of lead/read

机译:焊桥检查方式及其器件无铅/无铅

摘要

PURPOSE:To decide whether or not there is a solder bridge by setting window at positions between leads for respective images of the component, and finding the spatial differential value of brightness in the lengthwise direction of the leads as to respective images in the windows. CONSTITUTION:A controller 12 operates a lighting device 11 to light the component 11 to be inspected uniformly and an image pickup device 2 is put in operation to pick up the image of reflected light from the component 1. The image of the component 1 which is obtained by the device 2 is supplied to the device 12, which sets the window at the position between respective leads of the image; while the respective windows are scanned in the lengthwise direction of the leads in picture element units, the mean value of the brightness in each window is found at each scanning position and the difference value between the mean value of brightness at a last scanning position and the mean value of brightness at a current scanning position is found as a spatial differential value. Then the difference value of brightness is compared with a specific threshold value to check whether or not the difference value of brightness exceeds the threshold value, thereby deciding whether or not there is a solder bridge.
机译:目的:通过在组件的各个图像的引线之间的位置设置窗口,并针对窗口中的各个图像求出引线长度方向上亮度的空间微分值,从而确定是否存在焊桥。构成:控制器12操作照明装置11以均匀地照亮待检查的部件11,并且使图像拾取装置2工作以从部件1拾取反射光的图像。部件1的图像是由设备2获得的信息被提供给设备12,设备12将窗口设置在图像的各引线之间的位置处。在以像素为单位沿引线的长度方向扫描各个窗口时,在每个扫描位置找到每个窗口的亮度平均值,最后一个扫描位置的亮度平均值和像素之间的差值可以找到。找到当前扫描位置处的亮度平均值作为空间微分值。然后,将亮度差值与特定阈值进行比较,以检查亮度差值是否超过阈值,从而确定是否存在焊桥。

著录项

  • 公开/公告号JP3038718B2

    专利类型

  • 公开/公告日2000-05-08

    原文格式PDF

  • 申请/专利权人 オムロン株式会社;

    申请/专利号JP19890025109

  • 发明设计人 來海 雅俊;

    申请日1989-02-02

  • 分类号G01N21/956;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-22 02:03:35

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