Support module for a micro-ball grid array (BGA) device for testing semiconductor devices and solder connections, includes projections and elastic device to hold the module body and test container

摘要

A reception unit (12) is mounted on the surface of the module body (10,28). Projections (22, 24) extend from opposite sides of the module body with an elastic device held between them that surrounds the opposite sides of the module body to bring the opposite sides together along with a holding section (40) and test container (106).