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Lead elution decrease treatment manner of lead content copper alloy and lead elution decrease plated manner and lead content copper alloy make aqueduct instrument tool null of lead content copper
Lead elution decrease treatment manner of lead content copper alloy and lead elution decrease plated manner and lead content copper alloy make aqueduct instrument tool null of lead content copper
The present invention provides a lead dissolution preventing treatment method of a lead containing copper alloy for preventing lead from leaching from a lead containing copper alloy plug or the like, and a lead-free copper alloy water supply device which prevents the lead from leaching. Further, by forming a chromate coating on the surface of the lead containing copper alloy material, it is possible to reduce the dissolution of lead remaining slightly on the surface. In addition, in the pretreatment step of the nickel chromium plating process, a water supply device made of lead containing copper alloy is immersed in an alkaline type etching solution, and the lead of the surface of the lead containing copper alloy material is selectively removed, and is activated in the solution such as sulfuric acid, hydrochloric acid and the like. After the nickel plating is carried out, chromium plating may be performed in a Sargent chrome or chromium fluoride plating bath and immersed in a chromate solution to form a chromate coating.
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