首页> 外国专利> Lead elution decrease treatment manner of lead content copper alloy and lead elution decrease plated manner and lead content copper alloy make aqueduct instrument tool null of lead content copper

Lead elution decrease treatment manner of lead content copper alloy and lead elution decrease plated manner and lead content copper alloy make aqueduct instrument tool null of lead content copper

机译:减少铅含量的铜合金的铅洗脱处理方式和减少铅洗脱的镀层方式和铅含量的铜合金使渡槽仪表工具的铅含量铜无效

摘要

The present invention provides a lead dissolution preventing treatment method of a lead containing copper alloy for preventing lead from leaching from a lead containing copper alloy plug or the like, and a lead-free copper alloy water supply device which prevents the lead from leaching. Further, by forming a chromate coating on the surface of the lead containing copper alloy material, it is possible to reduce the dissolution of lead remaining slightly on the surface. In addition, in the pretreatment step of the nickel chromium plating process, a water supply device made of lead containing copper alloy is immersed in an alkaline type etching solution, and the lead of the surface of the lead containing copper alloy material is selectively removed, and is activated in the solution such as sulfuric acid, hydrochloric acid and the like. After the nickel plating is carried out, chromium plating may be performed in a Sargent chrome or chromium fluoride plating bath and immersed in a chromate solution to form a chromate coating.
机译:本发明提供一种用于防止铅从含铅的铜合金插头等中浸出的含铅的铜合金的防止铅溶解的处理方法,以及防止铅的浸出的无铅铜合金供水装置。另外,通过在含铅的铜合金材料的表面上形成铬酸盐被膜,可以减少残留在表面的铅的溶解。另外,在镍铬电镀工艺的预处理步骤中,将由含铅的铜合金制成的供水装置浸入碱性蚀刻溶液中,并选择性地去除含铅的铜合金材料表面的铅,并在溶液中被活化,例如硫酸,盐酸等。在进行镍镀覆之后,可以在萨金特铬或氟化铬镀浴中进行铬镀,并浸入铬酸盐溶液中以形成铬酸盐涂层。

著录项

  • 公开/公告号JP3182765B2

    专利类型

  • 公开/公告日2001-07-03

    原文格式PDF

  • 申请/专利权人 東陶機器株式会社;

    申请/专利号JP19990530608

  • 发明设计人 河本 理之;後藤 晶;今本 光男;

    申请日1998-12-02

  • 分类号C23F1/44;C23C22/24;C23F1/34;E03B7/09;E03C1/02;

  • 国家 JP

  • 入库时间 2022-08-22 01:33:51

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