METHOD FOR ENHANCING RELIABILITY OF DEVICE BY SELECTIVELY REDUCING POPULATION OF SOLDER BALL FROM FOOTPRINT OF BALL GRID ARRAY PACKAGE

摘要

PROBLEM TO BE SOLVED: To enhance the reliability of a device in a GBA package. ;SOLUTION: The population of solder balls 12 (and the respective solder ball pads 34, vias 32 and traces or lines 30 of those solder balls 12) is selectively reduced from the conventional footprint of a ball grid array(BGA) package, whereby a distribution line technique for enhancing the reliability of a device in the BGA package and the BGA package modified so as to enhance the reliability are disclosed. This distribution line technique uses gaps to generate from the solder balls made a population reduction as an additional space for distributing the traces or the lines from the solder ball pads to the outer surface of a substrate 14 mounted with semiconductor dies 20. The number of the solder balls of the package, which is continued to more reduce while holding the optimum diamater of the vias, is increased. Hereby, the reliability of the device is enhanced.;COPYRIGHT: (C)2001,JPO