System and process for melting and evaporating a solid material continuously, the system of coating by vapor deposition, the electrode continuously fed, apparatus of electric arc discharge.Processes for producing an electric arc discharge, coating by vapor deposition, to ionize a vapor coating.To measure the degree of ionization and the rate of evaporation from an evaporator in a system of coating by vapor deposition and to remove material deposited in a vacuum cell for a VThe coating affixed.

摘要

System and process for melting and evaporating a solid material continuously, the system of coating by vapor deposition, the electrode continuously fed, apparatus of electric arc discharge.Processes for producing an electric arc discharge, coating by vapor deposition, to ionize a vapor coating.To measure the degree of ionization and the rate of evaporation from an evaporator in a system of coating by vapor deposition and to remove material from a cell positado in vacuum by aSteam coating ". Apparatus and process for use in coating by vacuum vapor deposition, operation more simple, economical and continuous.A system and process for continuously effecting the melting and evaporation of a solid material to form a vapor coating includes the use of a melting crucible and crucible separately evaporau00e7u00e3O.A system and process for energizing the solids to form a plasma evaporu00e1veis comprising first and second electrodes and a device for selectively switching the polarity between the firstThe second electrodes and to prevent vapor deposition coating on the electrodes.A system and process for energizing the solids to form a plasma evaporu00e1veis that include a device to discharge electric arc with a cathode and an anode part part.A continuously fed electrode is presented for continuous vaporization of states of electrode in electric arc discharge.An apparatus and process to ensure the measurement of evaporation rate of an evaporator and the degree of ionization in a system of coating by vapor deposition.Finally, a system is presented for in-situ cleaning of deposits vaporizu00e1veis for cleaning of the enclosure of the system of vacuum vapor deposition.