Process for microstructuring plastic which is sensitive to X-rays comprises applying plastic layer to conducting surface of a substrate, partially radiating, selectively removing radiated regions and applying layer of conducting carbon

摘要

Process for microstructuring a plastic which is sensitive to X-rays comprises applying a layer of plastic to the conducting surface of a substrate, partially radiating the plastic layer via a mask producing irradiated and non-radiated regions, selectively removing the radiated regions by chemical dissolution, and providing the substrate with a layer of conducting carbon having a conducting surface.