METHOD FOR MANUFACTURING LIQUID INJECTION SEALING UNDERFILL MATERIAL, LIQUID INJECTION SEALING UNDERFILL MATERIAL AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a liquid injection sealing underfill material capable of exhibiting stable injecting property.;SOLUTION: A method for manufacturing the liquid injection sealing underfill material comprising (1) a process in which an epoxy resin (A) liquid at normal temperature, a silane coupling agent (C) and other additives are kneaded to produce an intermediate raw material (F), (2) a process in which the intermediate raw material (F) and an inorganic filler (D) are kneaded to produce an intermediate raw material (G), (3) a process in which the intermediate raw material (G) is cured under the environment at 20-30°C for ≥12 hr and 100 hr, and (4) a process in which the cured intermediate raw material (G) and an aromatic diamine (B) are compounded and kneaded. Further, the liquid injection sealing underfill material produced by the above method.;COPYRIGHT: (C)2002,JPO