A NOVEL EMBEDDED METAL SCHEME FOR LIQUID CRYSTAL DISPLAY (LCD) APPLICATION

摘要

A process for forming a planarized metal layer byforming the plug and overlying metal interconnectsimultaneously in order to maintain a uniform gap between thepassivation layer of a bottom substrate and the top substrateof a LCD integrated circuit device is described.Semiconductor device structures in and on a semiconductorsubstrate wherein the semiconductor device structures arecovered by an insulating layer. A trench is patterned intothe insulating layer and a via opening is made within thetrench through the insulating layer to one of the underlyingsemiconductor device structures. A metal layer is depositedoverlying the insulating layer and within the trench and viaopening. The metal layer overlying insulating layer ispolished away leaving the metal layer within the trench toform a metal pixel and within the via opening to form aninterconnect between the metal pixel and the underlyingsemiconductor device wherein the top surface of the substrateis planarized. A passivation layer is deposited overlyingthe top surface of the substrate. A liquid crystal materiallayer is formed overlying the passivation layer andsandwiched between the bottom substrate and a secondsemiconductor substrate to complete the fabrication of theliquid crystal display integrated circuit device.(FIGURE 2 IS SUGGESTED FOR PUBLICATION)