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Piezoresistive pressure sensor manufacturing method has chip and/or component temporarily attached to carrier or base with subsequent removal after further manufacturing steps
Piezoresistive pressure sensor manufacturing method has chip and/or component temporarily attached to carrier or base with subsequent removal after further manufacturing steps
The manufacturing method has a chip and/or an electrical/electronic component (1) attached to a carrier or a base (7) via an adhesive, before subjecting it to further manufacturing steps, with subsequent removal of the adhesive, for release of the chip or component from the carrier or base.
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