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OPTICAL ISOLATOR CHIP AND MANUFACTURING METHOD THEREOF, AND OPTICAL ISOLATOR AND OPTICAL ISOLATOR MODULE USING THE OPTICAL ISOLATOR CHIP

机译:光学隔离器芯片及其制造方法,以及使用该光学隔离器芯片的光学隔离器和光学隔离器模块

摘要

PROBLEM TO BE SOLVED: To provide a compact, inexpensive, and reliable laminate a optical isolator.;SOLUTION: The optical isolator comprises an optical element and a retention frame 15. In the optical element, a Faraday rotator 1c is interposed between a pair of polarizers 1a and 1c for lamination. The retention frame 15 is deposited to an outer-periphery section on the side of the optical element, and is made of resin or a cured object of resin where metal powder, half metal powder, or a semiconductor powder are mixed. The thickness of the retention frame 15 is 40 μm or more and 1 mm or less.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:为了提供紧凑,便宜且可靠的层压板,一种光学隔离器。解决方案:该光学隔离器包括一个光学元件和一个固定框架15。在光学元件中,法拉第旋转器1c插入在一对光学元件之间。用于层压的偏振器1a和1c。保持框架15被沉积到光学元件侧的外围部分,并且由树脂或树脂的固化物制成,其中金属粉末,半金属粉末或半导体粉末被混合。保持框架15的厚度为40μm以上且1mm以下。版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2003248192A

    专利类型

  • 公开/公告日2003-09-05

    原文格式PDF

  • 申请/专利权人 SUMITOMO METAL MINING CO LTD;

    申请/专利号JP20020049491

  • 发明设计人 NOGUCHI KENICHI;NAKAI TSUKASA;

    申请日2002-02-26

  • 分类号G02B27/28;G02B5/30;

  • 国家 JP

  • 入库时间 2022-08-22 00:16:06

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