Optically Guiding Substrates for Low Cost Optical Interconnects in Stacked Multichip Module and Chip Scale Packaging

摘要

A novel method of integrating an optically guiding material into the support structure of the computer creates a high performance data buss while reducing the complexity and cost of implementing an optical interconnect scheme. This report discusses the use of optically guiding materials in both multichip module and chip-scale packaging schemes. In both implementations, closely spaced optical data channels are guided from one plane of electronic circuits to another without the need of costly micro-optics and complex alignment requirements.