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SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP AND A LEAD SUBSTRATE CONNECTED WITH EACH OTHER THROUGH PADS AND PATTERNED LEAD WIRES WITHOUT SHORT-CIRCUITING THE PADS
SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP AND A LEAD SUBSTRATE CONNECTED WITH EACH OTHER THROUGH PADS AND PATTERNED LEAD WIRES WITHOUT SHORT-CIRCUITING THE PADS
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机译:半导体器件具有一个半导体芯片,并且铅基质与其他每个贯通的垫板和带图案的引线相连,而无需短路板
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摘要
PURPOSE: To overcome a problem where when forming electrical connection paths with an outside of a device by connecting a chip to a leadframe, lead terminals of the leadframe corresponding to each pad formed on the chip are necessary and these are wirebonded to each other with a one-to-one correspondence, and thus if a pitch of pads, for example, is different for each chip, the leadframe must be made for each chip. CONSTITUTION: A semiconductor device of the invention comprises pattern sections for electrical connection, which consist of a plurality of lead patterns that are formed on a mounting region of a support member, are arrayed longer than the length of the column of terminals for electrical connection with a smaller pitch than an array pitch of the terminals for electrical connection of a semiconductor chip, and each have a smaller width than the array pitch of the terminals for electrical connection, where when the semiconductor chip is mounted on a mounting surface, the lead patterns, while keeping non- continuity between respective terminals for electrical connection, contact the respective terminals.
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