首页> 外国专利> THERMALLY FUSIBLE POLYIMIDE FILMS, LAMINATED SHEET USING POLYIMIDE FILM AND METHOD FOR MANUFACTURING POLYIMIDE FILM/LAMINATED SHEET

THERMALLY FUSIBLE POLYIMIDE FILMS, LAMINATED SHEET USING POLYIMIDE FILM AND METHOD FOR MANUFACTURING POLYIMIDE FILM/LAMINATED SHEET

机译:热熔聚酰亚胺膜,使用聚酰亚胺膜的层压板以及制造聚酰亚胺膜/层压板的方法

摘要

PROBLEM TO BE SOLVED: To provide a thermally fusible polyimide film with high heat resistance which is used for manufacturing a one side metallic foil laminated sheet, especially a one side copper-plated laminated sheet, both not using a release paper during laminating a metallic foil, and a one side metallic foil laminated sheet, especially a one side copper-plated laminated sheet, both using the polyimide film.;SOLUTION: This polyimide film has a thermally fusible polyimide layer with a thickness of 4 to 45 μm formed on both surfaces of a heat-resistant polyimide layer (an S1 layer) with almost the same thickness as the former and a total thickness of 3 to 10 μm of the thickness of the thermally fusible polyimide layer formed on one surface of the heat-resistant polyimide layer (the S1 layer) and the thickness of the thermally fusible polyimide layer formed on the other surface. In addition, the 0.1 to 2 μm thick heat-resistant polyimide layer (an S2 layer) without heat fusibility is laminated on the thermally-fusible polyimide layer one surface of the heat-resistant polyimide layer (the S1 layer), so that the polyimide film has heat fusibility only on one surface. Thus the polyimide film having the heat fusibility on one surface and a copper foil are laminated over each other by thermal contact bonding through the polyimide layer with the heat fusibility.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种具有高耐热性的热熔聚酰亚胺膜,该膜用于制造单面金属箔层压板,特别是单面镀铜层压板,在层压金属箔时均不使用离型纸;和一侧金属箔层压板,特别是一侧镀铜层压板,均使用聚酰亚胺膜。;解决方案:该聚酰亚胺膜具有热熔性聚酰亚胺层,其厚度为4至45μm。耐热聚酰亚胺层(S1层)的两个表面的厚度几乎与前者相同,并且形成在热-聚酰亚胺层的一个表面上的可热熔聚酰亚胺层的总厚度为3至10μm。耐性聚酰亚胺层(S1层)和在另一表面上形成的热熔性聚酰亚胺层的厚度。另外,在耐热性聚酰亚胺层(S1层)的一面的热熔性聚酰亚胺层上,层叠没有热熔合性的0.1〜2μm厚的耐热性聚酰亚胺层(S2层),聚酰亚胺膜仅在一个表面上具有热熔性。因此,通过具有热熔性的聚酰亚胺层通过热接触键合,在一个表面上具有热熔性的聚酰亚胺膜和铜箔彼此层压。COPYRIGHT:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004230670A

    专利类型

  • 公开/公告日2004-08-19

    原文格式PDF

  • 申请/专利权人 UBE IND LTD;

    申请/专利号JP20030020942

  • 申请日2003-01-29

  • 分类号B32B27/34;B32B15/08;B32B31/08;H05K1/03;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 23:35:18

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号