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PLATING BATH, METHOD OF PRODUCING PLATING COATING, AND METHOD OF PRODUCING RARE EARTH MAGNET

机译:镀液,镀层的制造方法以及稀土磁铁的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a plating bath with which a rare earth magnet having excellent magnetic properties, adhesion properties and corrosion resistance can efficiently be produced by jointly using electroplating and electroless plating, to provide a method of producing a plating coating, and to provide a method of producing a rare earth magnet.;SOLUTION: A substrate 20 (magnet base body) is subjected to electrolytic treatment with a plating bath 10 in the jointly use of electroplating and electroless plating having a pH within the range in which a film deposition rate by electroless plating reaction is controlled to ≤0.3 μm/h, and also within the range of -2.0 from a value in which a film deposition rate by electroless plating reaction is controlled to 1.0 μm/h. In the vicinity of the surface of the substrate 20, the electroless plating reaction progresses in a recessed part 20A at which pH is locally increased, and only the electroplating reaction progresses in the region other than the recessed part 20A, so that a plating coating 30 (protective film) is formed so as to sufficiently cover the surface ruggedness of the substrate 20. Further, the ratio occupied by the electroless plating reaction is reduced in the whole of the plating reaction, so that the amount of hydrogen to be generated reduces.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:解决的问题:提供一种电镀液,通过结合使用电镀和化学镀可以有效地生产出具有优异磁性能,粘附性能和耐腐蚀性的稀土磁体,并提供了一种生产电镀涂层的方法,以及提供一种生产稀土磁体的方法。;解决方案:将基板20(磁体基体)通过电镀浴和电镀浴10进行电解处理,将电镀和化学镀膜的pH值控制在薄膜范围内。通过化学镀反应的成膜速度控制为±0.3μm/ h,并且将通过化学镀反应的成膜速度控制为1.0μm/ h的值在-2.0的范围内。在基板20的表面附近,在局部增加pH的凹部20A中进行化学镀覆反应,在凹部20A以外的区域中仅进行电镀反应,从而形成镀覆膜30。形成(保护膜)以充分覆盖基板20的表面粗糙度。此外,在整个电镀反应中,化学镀反应所占的比例降低,从而产生的氢量减少。 ;版权:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004250770A

    专利类型

  • 公开/公告日2004-09-09

    原文格式PDF

  • 申请/专利权人 TDK CORP;

    申请/专利号JP20030045112

  • 发明设计人 SHINOURA OSAMU;

    申请日2003-02-21

  • 分类号C23C18/31;C25D7/00;H01F41/02;

  • 国家 JP

  • 入库时间 2022-08-21 23:30:11

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