Printed wiring boards, multilayer printed wiring boards, and to foreign objects void detection method in the inner layer of the multilayer printed wiring board

摘要

The multilayer printed wiring board, the inner layer 11B of the partial substrate discard multilayer printed wiring board, and the electrode 20, the first, the second electrode 23 adjacent to the electrode 20 of the first is formed on the outer surface, terminal portion of the first and the terminal of the die 2 is electrically connected to the second electrode 23 is formed is electrically connected to the first electrode 20.