PACKAGE STRUCTURE OF SURFACE MOUNTED TYPE ELECTRONIC COMPONENT, INCLUDING CASE HAVING SOFTENING TEMPERATURE HIGHER THAN REFLOW TEMPERATURE AND COVER HAVING SOFTENING TEMPERATURE LOWER THAN REFLOW TEMPERATURE

摘要

PURPOSE: A package structure is provided to prevent a cover from being stripped off from a case during reflow and degradation of bonding strength, by reducing stresses on the bonded surface between the case and the cover. CONSTITUTION: A package structure comprises a case(10) for accommodating electronic component elements therein; and a cover(20) bonded and fixed at an opening of the case. The case has a softening temperature higher than a reflow temperature. The cover has a softening temperature lower than a reflow temperature. The case and the cover are bonded to each other by using an epoxy based or silicon based adhesive. The softening temperature of the cover is 180 to 240 degrees.