首页>外文会议>SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000

SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000

召开年：
召开地：
出版时间：-

会议文集：-

会议论文

热门论文

全部论文

全选（0）

1.Stecil design improvement for bumping wafers by printing solder paste

机译：通过印刷焊膏使凸点晶圆的模板设计改进
- 作者：Jeffrey D.Schake;K.Srihari;Peter Borgesen
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- flip chip;
- stencil printing;
- wafer bumping.;
2.Stencil design guidelines

机译：模具设计准则
- 作者：William E.Coleman
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
3.Test and inspection: tools to improve process control

机译：测试和检查：改善过程控制的工具
- 作者：Lynn Leone
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
4.The benefits of turnover and whay you should do to prevent it

机译：周转的好处以及为什么要防止周转
- 作者：Paul E.Slobodian
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
5.The everchanging EMS business model

机译：不断变化的EMS商业模式
- 作者：Mark Lyell
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
6.The impact of automated optical inspection

机译：自动化光学检查的影响
- 作者：Kevin A.Towle
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
7.The impact of lead-free reflow temperatures on the moisture sensitivity performance of plas ic surface mount packages

机译：无铅回流温度对塑料表面贴装封装的湿敏性能的影响
- 作者：B.T.Vaccaro;R.L.Shook;D.L.Gerlach
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- lead-free;
- moisture sensitivity;
- reflow;
8.The reliability assessment of wafer-level CSP(Omega-CSP)

机译：晶圆级CSP（Omega-CSP）的可靠性评估
- 作者：Jong-Heon Kim;In-Too Kang;M.G.Park;J.Y Kim;Hun Han;Jin Yu
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- wafer-level CSP;
- solder joint reliability;
- omega CSP;
- stress buffer layer;
9.The role of quality and test modeling in the manufacture of complex electronic assemblies

机译：质量和测试模型在复杂电子组件制造中的作用
- 作者：Paul A.Thistle
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
10.The state of component locating and handling for odd-form assembly

机译：异型装配的零件定位和处理状态
- 作者：Gregory W.Holcomb
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- odd-form;
- automation;
- locating;
- handling.;
11.The ternary eutectic of Sn-Ag-Cu solder alloys

机译：Sn-Ag-Cu焊料合金的三元共晶
- 作者：K.-W.Moon;W.J.Boettinger;U.R.Kattner;F.S.Biancaniello;C.A.Handwerker
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- Pb-free solder;
- phase diagram;
- Sn-Ag-Cu;
- ternary eutectic;
- and thermal analysis;
12.The worldwide OEM electronics assembly market, 1999

机译：1999年全球OEM电子组装市场
- 作者：Randall Sherman
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
13.Thermal cycling test results of CSP and RF package assemblies

机译：CSP和RF封装组件的热循环测试结果
- 作者：Reza.Ghaffarian;George nelson;Mark Cooper;Derek Lam;Steve Strudler;Abhay Umdekar
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
14.Two-scale model-based simulation of a solder alloy

机译：基于两尺度模型的焊料合金仿真
- 作者：Michael W.Woodmansee;Richard W.Neu
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
15.Ultra-thin flip chip on board assembly

机译：超薄倒装芯片组装
- 作者：Jie Zhang;James Skinner;John Szezech;Daniel Gamota;Motorola Labs
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- ultra-thin flip chip;
- flip chip assembly;
- reliability;
- and mechanical property;
16.Underfill characterization for flip chip BGA featuring use of a rigid substrate

机译：采用刚性基板的倒装芯片BGA的底部填充特性
- 作者：Kunio Sakamoto
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- underfill;
- flip chip;
- BGA;
- rigid substrate;
17.Using production defect data to improve an SMT assembly process

机译：使用生产缺陷数据改善SMT组装过程
- 作者：Glen Leinbach
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
18.Vectoral imaging- the new direction in automated optical inspection

机译：向量成像-自动化光学检测的新方向
- 作者：Mark J.Norris
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- AOI;
- inspection;
- template matching;
- vectoral imaging;
- synthetic modeling;
- vectors;
- pixelization;
19.Wire bonding and reliability of multi-layer copper interconnect structures

机译：多层铜互连结构的引线键合和可靠性
- 作者：Lei Mercado;Robert Radke;matthew Ruston;Tu Anh Tran;Bill Williams;Lois Yong;Audi Chen Scott Chen
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
20.X-ray solder slicing using transmission X-ray systems and standalone software~((1))

机译：使用透射X射线系统和独立软件的X射线焊料切片〜（（1））
- 作者：Richard B.Knight
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年
- BGA;
- voiding;
- x-ray inspection;
- 3-D laminography;
21.Year 1999 defect level and fault spectrum study

机译：1999年缺陷水平和故障谱研究
- 作者：Stig Oresjo
- 会议名称：《SMTA(Surface Mount Technology Association) The Technical Program Conference Chicago, Illinois September 24-28, 2000》 | 2000年