首页> 外国专利> MULTILAYERED STRUCTURE INCLUDING EPITAXIAL LAYER WITH LOW DISLOCATION DENSITY, SEMICONDUCTOR DEVICE USING THE SAME AND FABRICATING METHOD THEREOF TO EMBODY LOW DISLOCATION DENSITY AND REDUCE THICKNESS

MULTILAYERED STRUCTURE INCLUDING EPITAXIAL LAYER WITH LOW DISLOCATION DENSITY, SEMICONDUCTOR DEVICE USING THE SAME AND FABRICATING METHOD THEREOF TO EMBODY LOW DISLOCATION DENSITY AND REDUCE THICKNESS

机译:包含低位移密度的外延层的多层结构,使用相同结构的半导体器件及其制造方法来体现低位移密度并减小厚度

摘要

PURPOSE: A multilayered structure including an epitaxial layer with a low dislocation density is provided to embody a low dislocation density and reduce its thickness by inserting an intermediate epitaxial layer into a hetero-epitaxial layer such that the intermediate epitaxial layer is thinner than the hetero-epitaxial layer. CONSTITUTION: A substrate is prepared. A hetero-epitaxial layer(200) is formed on the substrate, having a different lattice constant from that of the substrate. At least one intermediate epitaxial layer(300) is inserted into the hetero-epitaxial layer. The intermediate epitaxial layer has a different lattice constant from that of the hetero-epitaxial layer in contact with the intermediate epitaxial layer. The thickness of the intermediate epitaxial layer is smaller than that of the hetero-epitaxial layer to absorb the strain of the hetero-epitaxial layer.
机译:目的:提供一种多层结构,包括低位错密度的外延层,以体现低位错密度并通过将中间外延层插入异质外延层,以使中间外延层比异质外延层更薄来减小其厚度。外延层。组成:准备好基材。异质外延层(200)形成在基板上,具有与基板不同的晶格常数。至少一个中间外延层(300)被插入异质外延层中。中间外延层具有与与中间外延层接触的异质外延层不同的晶格常数。中间外延层的厚度小于异质外延层的厚度,以吸收异质外延层的应变。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号