ACIDIC SOLUTION FOR SILVER DEPOSITION AND METHOD FOR SILVER LAYER DEPOSITION ON METAL SURFACES

摘要

In contrast to the solutions and methods of the prior art, without a fade-resistant compound is used, the treatment solution and method can be a solder having a characteristic that does not deteriorate even after storage and possible combinations are used for the production of the layer are used. The deposition acidic solution contains an ion and one or more copper (I) complexing agent, and the copper (I) complexing agent is selected from the group comprising a compound having the formula I below: