首页> 外国专利> SEMICONDUCTOR DEVICE AND POWER CONVERTER, DRIVING INVERTER, GENERAL-PURPOSE INVERTER AND HIGH-POWER HIGH-FREQUENCY COMMUNICATION DEVICE USING SAME

SEMICONDUCTOR DEVICE AND POWER CONVERTER, DRIVING INVERTER, GENERAL-PURPOSE INVERTER AND HIGH-POWER HIGH-FREQUENCY COMMUNICATION DEVICE USING SAME

机译:半导体装置和电源转换器,驱动变频器,通用变频器和高功率高频通信装置使用相同的装置

摘要

By reducing the surface roughness of a silicon carbide semiconductor substrate which has a p-type and an n-type impurity semiconductor regions formed by ion implantation and is used in a semiconductor device, electric characteristics of the semiconductor device are improved as a consequence. The semiconductor device is a Schottky barrier diode or a PN diode wherein at least one of a P-type semiconductor region (3) and an N-type semiconductor region is selectively formed by ion implantation in a silicon carbide semiconductor region (1, 2) having a (000-1) surface or a surface inclined at a certain angle to the (000-1) surface as the outermost layer surface, and a metal electrode is formed on the outermost layer surface. By applying a voltage to the metal electrode, the direction of a current flowing vertically to the outermost layer surface is controlled.
机译:通过减小具有通过离子注入形成的p型和n型杂质半导体区域并用于半导体器件中的碳化硅半导体衬底的表面粗糙度,结果,改善了半导体器件的电特性。半导体器件是肖特基势垒二极管或PN二极管,其中,通过离子注入在碳化硅半导体区域(1、2)中选择性地形成P型半导体区域(3)和N型半导体区域中的至少一个。具有(000-1)表面或相对于(000-1)表面倾斜一定角度的表面作为最外层表面,并且在最外层表面上形成金属电极。通过向金属电极施加电压,来控制垂直流向最外层表面的电流的方向。

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