Method for forming protective cover for electronic component, e.g. acoustic wave filter, resonator, sensor and/or actuator, involves depositing second layer onto first cover layer and forming aperture in second cover layer

摘要

A protected component is contained in substrate (100) and the method includes deposition of first cover layer (110) onto substrate, at least over region (104) containing component and forming at least one aperture (112a) in first cover layer, exposing substrate region, containing component. The aperture is filled with appropriate material (118). Second layer (150) is deposited onto first cover layer with filled aperture. In second cover layer is formed at least one second aperture (152) to expose region of filling material, which is then removed and aperture in second cover layer is closed.