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Trench metal isolator semiconductor component, especially for high frequency use, is formed in semiconductor substrate with active and inactive regions; active region contains trench with conductive gate material, source region, body region
Trench metal isolator semiconductor component, especially for high frequency use, is formed in semiconductor substrate with active and inactive regions; active region contains trench with conductive gate material, source region, body region
The metal isolator semiconductor device is formed in a semiconductor substrate and contains an active region and an inactive region, whereby the active region contains a first trench containing a first conductive gate material, a source region in the substrate and a body region next to a trench side wall, whereby the trench is clad with a thin insulation layer, and the inactive region contains a second trench containing a second conductive material, a relatively thin insulating layer on a side wall of the second trench, a relative thick insulating layer on its floor and a gate bus in contact with the second conductive material.
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