Severe environment temperature modelling for military electronic board applications having sub assemblies/components environment defined/thermal model developed/compared then process repeated/optimised

摘要

The electronic system thermal modelling process has an assembly of electronic boards. The process defines the electronic boards (Cfi) with sub assemblies and components. There is a first definition of the environment between the boards (v1 to v3), followed by thermal modelling and comparison. The steps are then repeated to optimise the results.