ELECTRONIC COMPONENT SUBJECTED TO SURFACE MOUNTING ON WIRING BOARD, CIRCUIT HAVING ELECTRONIC COMPONENT SUBJECTED TO SURFACE MOUNTING AND PRINT DEVICE

摘要

PROBLEM TO BE SOLVED: To realize an electronic component which easily ensures a contact area to a heat dissipation member and is subjected to surface mounting on a wiring board.;SOLUTION: The electronic component has a projection for positioning the contact surface of the surface-mounting electronic component with a heat dissipation member brought into contact therewith, and a wiring board at a prescribed distance.;COPYRIGHT: (C)2006,JPO&NCIPI