LSI PACKAGE HAVING INTERFACE FUNCTION WITH OUTSIDE, IMPLEMENTATION HAVING LSI PACKAGE PROVIDED WITH INTERFACE FUNCTION WITH OUTSIDE AND MANUFACTURING METHOD OF IMPLEMENTATION HAVING LSI PACKAGE PROVIDED WITH INTERFACE FUNCTION WITH OUTSIDE

摘要

PPROBLEM TO BE SOLVED: To provide an LSI package having an interface function with an outside, with which a mounting problem is small and space of mounting can be saved by presuming high through put without need of an expensive transmission line an implementation and a manufacturing method of the implementation thereof. PSOLUTION: The package is provided with an interposer having a face where a connection conduction terminal to a board is arranged and an interface module which is electrically and mechanically connected and arranged onto a face same as that where the connection conduction terminal of the interposer is arranged and interfaces signal input/output between the outside and the interposer, or an interphase module which is electrically and mechanically connected and arranged onto a face opposite to the face to which the interposer of the mounting board is connected and interfaces signal input/output between the outside and the interposer through the mounting board. PCOPYRIGHT: (C)2006,JPO&NCIPI