首页> 外国专利> WAVE SOLDER NOZZLE WITH AN EXIT TROUGH HAVING A WEIR, A SURFACE OF THE THROUGH BEING WETTABLE BY SOLDER; A WAVE SOLDERING MACHINE WITH SUCH NOZZLE; A METHOD OF IMPROVING THE FLOW OF SOLDER OUT OF A WAVE SOLDER NOZZLE

WAVE SOLDER NOZZLE WITH AN EXIT TROUGH HAVING A WEIR, A SURFACE OF THE THROUGH BEING WETTABLE BY SOLDER; A WAVE SOLDERING MACHINE WITH SUCH NOZZLE; A METHOD OF IMPROVING THE FLOW OF SOLDER OUT OF A WAVE SOLDER NOZZLE

机译:带有一个出口槽的波状喷嘴,具有一个堰,该喷嘴的整个表面可被锡润湿;带喷嘴的波峰焊机;一种提高波峰焊嘴出流的方法

摘要

A wave solder nozzle (42) is capable of delivering solder material to performa wave soldering operation on a printed circuit board (18) in an inertatmosphere. The wave solder nozzle (42) includes a front plate (48) and a backplate (50) coupled to the front plate (48). The front plate (48) and the backplate (50) define a channel (52) through which solder material (54) flows. Thenozzle (42) further includes an exit trough (58) extending from the back plate(52). The exit trough (58) has a weir (60) provided at one end of the exittrough (58). The exit trough (58) is constructed and arranged to control theflow of solder material (54) from the wave solder nozzle (42). A surface ofthe exit trough (60) is wettable to improve the flow of solder material (54)out of the wave solder nozzle (42). A method of improving the flow of soldermaterial (52) through the nozzle (42) is also disclosed.
机译:波峰焊喷嘴(42)能够输送焊料以执行在惰性气体中对印刷电路板(18)进行波峰焊操作大气层。波峰焊喷嘴(42)包括前板(48)和后板板(50)连接到前板(48)。前板(48)和后板板(50)限定通道(52),焊料(54)流过该通道(52)。的喷嘴(42)还包括从背板延伸的出口槽(58)(52)。出口槽(58)在出口的一端具有堰(60)。槽(58)。出口槽(58)的结构和布置可控制从波峰焊嘴(42)流出的焊锡材料(54)。的表面出口槽(60)可润湿以改善焊料(54)的流动从波峰焊喷嘴(42)中伸出。一种改善焊料流动性的方法还公开了通过喷嘴(42)的材料(52)。

著录项

  • 公开/公告号CA2593752A1

    专利类型

  • 公开/公告日2006-08-31

    原文格式PDF

  • 申请/专利权人 SPEEDLINE TECHNOLOGIES INC.;

    申请/专利号CA20062593752

  • 发明设计人 MORRIS JAMES M.;

    申请日2006-02-13

  • 分类号B23K1/08;B23K1;B23K3/06;H05K3/34;

  • 国家 CA

  • 入库时间 2022-08-21 21:34:56

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