Estimation of relative rate of copper dissolution in wave soldering and through-hole rework process by designing an experiment for soldering parameters and PCB features.

摘要

The thesis details the study of influence of factors such as surface finish of PCB, copper content in PCB barrel, PCB thickness, type of solder alloy, type and process parameters of through-hole soldering process in determining the rates of copper dissolution in different through-hole soldering processes. The research was designed to conduct experiment in two phases. The first phase was to measure the copper dissolution that occurs during machine-based wave soldering processes and analyze the factors influencing it. The second phase was to measure the copper dissolution that occurs during a solder pot rework process and analyze the factors influencing it. The results from the experiment are used to identify the significance and magnitude of influence that each of the factors has on the rate of copper dissolution. These measurements are further used to estimate the rates of copper dissolution during through-hole rework process.