Soluble Polyimide for photosensitive polyimide and photosensitive polyimide composition comprising the soluble polyimide

摘要

The present invention is a photosensitive polyimide soluble polyimide and for precursor directed to a photosensitive polyimide precursor composition containing them, more particularly, comprises an hydroxyl group with an acetal in the side chain, and soluble polyimide that contains a reactive group blocked in one or both ends to: (PAG photo acid Generator) and a photosensitive polyimide precursor composition comprising a dissolution inhibitor, as needed, and the soluble polyimide, one or both ends the polyamic acid, an acid generator by light containing a reactive blockade in It relates.; Availability of the present invention poly be imide to give the very flat film when a large, the coating change of solubility in an aqueous alkali solution in the presence of an acid, and be present cross-linking time thermosetting polymer, leading to a terminal reactive blocking groups formed bar, that can be used in the photosensitive polyimide. In the case of a photosensitive polyimide precursor composition according to the present invention, the flatness is excellent during coating, no difference in dissolution rate between the transmitting portion and unexposed portion cursor, a small amount of a photosensitive agent to FIG thick polyimide as well as to obtain a pattern of high resolution possible to manufacture a layer, in the subsequent cure process of a low film shrinkage ratio of the film is excellent in physical properties of the obtained polyimide film.