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METHOD OF FORMING THIN FILM STRUCTURE, THIN FILM STRUCTURE, VIBRATION SENSOR AND ACCELERATION SENSOR

机译:薄膜结构的形成方法,薄膜结构,振动传感器以及加速度传感器

摘要

PPROBLEM TO BE SOLVED: To provide a method of forming a thin film structure having weak tensile stress controlled in mechanical stress and making an electrical continuity. PSOLUTION: After formation of lower layer film 35 of polysilicon film on the substrate 32 of Si etc., the lower layer film 35 is doped with impurity such as P and thermally diffused so as to make continuity. Then, on the lower layer film 35, the upper layer film 36 of polysilicon film which is only formed and not yet makes an electrical continuity, is formed. The upper layer film 36 is provided with tensile stress comparable with compressive stress of the lower layer film 35, and the thin film structure A composed of the lower layer film 35 and the upper layer film 36 is regulated so as to have a weak tensile stress as a whole. PCOPYRIGHT: (C)2007,JPO&INPIT
机译:<要解决的问题:提供一种形成薄膜结构的方法,该薄膜结构具有在机械应力中受控的弱拉伸应力并具有电连续性。

解决方案:在Si等的基板32上形成多晶硅膜的下层膜35之后,在下层膜35中掺杂P等杂质并进行热扩散以使其连续。然后,在下层膜35上,形成仅形成但尚未实现电导通的多晶硅膜的上层膜36。上层膜36被施加与下层膜35的压缩应力相当的拉伸应力,并且调节由下层膜35和上层膜36构成的薄膜结构A以具有弱的拉伸应力。整体上

版权:(C)2007,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007225362A

    专利类型

  • 公开/公告日2007-09-06

    原文格式PDF

  • 申请/专利权人 OMRON CORP;

    申请/专利号JP20060044870

  • 发明设计人 KASAI TAKASHI;WAKABAYASHI SHUICHI;

    申请日2006-02-22

  • 分类号G01H11/06;B81C1;B81B3;H01L29/84;G01L9;G01P15/125;G01P9/04;H04R19/04;H04R31;G01C19/56;

  • 国家 JP

  • 入库时间 2022-08-21 21:13:01

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