BONDING STATE EVALUATION METHOD AND DEVICE, TEST PIECE FOR BONDING STATE EVALUATION, MANUFACTURING METHOD OF TEST PIECE FOR BONDING STATE EVALUATION, AND SEMICONDUCTOR ELEMENT HAVING TEST PIECE FOR BONDING STATE EVALUATION

摘要

PROBLEM TO BE SOLVED: To solve the problems wherein a breaking test by a tensile test is used for conventional measurement of bonding strength of a structure laminating different kinds of members, and thereby a change with time of the bonding strength of the same sample cannot be tracked and examined.;SOLUTION: A laminate structure wherein a projection sandwiched between a substrate and a thin plate is bonded is manufactured. An exfoliated domain wherein the substrate and the thin plate are not bonded is generated around the projection when bonding the laminate structure. The size of the exfoliated domain is measured, and the bonding strength is evaluated nondestructively based on a mechanical property value such as the Young's modulus of the thin plate and the size of the exfoliated domain.;COPYRIGHT: (C)2007,JPO&INPIT