Pickup property evaluation method, dicing / die bonding integrated film, dicing / die bonding integrated film evaluation method and sorting method, and semiconductor device manufacturing method

摘要

The pick-up property evaluation method according to the present disclosure includes a step of preparing a dicing / die bonding integrated film to be evaluated having a base material layer, an adhesive layer and an adhesive layer in this order, and a condition of a peeling angle of 30 °. The first measurement step of measuring the adhesive force of the adhesive layer to the adhesive layer, the step of attaching a wafer having a thickness of 10 to 100 μm to the adhesive layer of the dicing / die bonding integrated film, and the wafer and the adhesive layer. Is separated into a chip with an adhesive piece of 9 mm ² or less, and the edge peeling when the edge of the chip with an adhesive piece is peeled off from the adhesive layer by pushing the central part of the chip with an adhesive piece from the base material layer side. It includes a second measuring step of measuring the strength.