Method for bonding FPC in adhesive process of ACF and structure for bonding FPC

摘要

This invention discloses an FPC bonding method and structure of the ACF attachment process. FPC bonding method disclosed in the invention, the mounting pressure on the ACF quality film series put on a backup tools (back up tool) phase; The step of clamping pressure by using a region other than the integrated tulreul After placing the pressure over the ACF; Step of retaining the status of long batul clamp (long bar tool) when removing the ACF separation film; And the FPC bonding structure of the ACF attachment process according to a bonding method, and the present invention which comprises the step of disassembly of the clamp state after removing the separation film ACF batul long (long bar tool), PCB / FPC bonding The guide frame provided in the rear of the backup tool; Target FPC put on the back tulsang; Is formed on the target FPC, film separation is to be separated by the separator; And a long guide bar is installed on the side of the backup tool and the target FPC;. Is configured to include a