首页> 外国专利> FABRICATION METHOD OF GAN SUBSTRATE

FABRICATION METHOD OF GAN SUBSTRATE

机译:fabrication method of Gan substrate

摘要

A fabrication method of a GaN substrate is provided to remove pits in a GaN growth process by using a Ga migration process. A preparation process is performed to prepare a substrate(1). A heating process is performed to heat the substrate. A growth process is performed to grow GaN on a surface of the substrate by supplying GaCl and NH3 to the inside of the reactor. In the growth process, the growth of GaN is controlled by adjusting intermittently the supplying amount of the NH3. The growth process includes a process for supplying NH3 and a process for interrupting NH3. The substrate is formed with one of a sapphire substrate, a SiC substrate, and a GaN substrate.
机译:提供了一种GaN衬底的制造方法,以通过使用Ga迁移工艺在GaN生长工艺中去除凹坑。执行准备过程以准备衬底(1)。进行加热工艺以加热基板。通过向反应器内部供应GaCl和NH 3,执行生长工艺以在衬底的表面上生长GaN。在生长过程中,通过间歇地调节NH3的供应量来控制GaN的生长。生长过程包括供应NH 3的过程和中断NH 3的过程。衬底由蓝宝石衬底,SiC衬底和GaN衬底之一形成。

著录项

  • 公开/公告号KR100695119B1

    专利类型

  • 公开/公告日2007-03-08

    原文格式PDF

  • 申请/专利权人 SAMSUNG CORNING CO. LTD.;

    申请/专利号KR20060006206

  • 发明设计人 PARK SUNG SOO;

    申请日2006-01-20

  • 分类号H01L33/12;

  • 国家 KR

  • 入库时间 2022-08-21 20:32:38

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号