Micro-electro-mechanical system substrate manufacturing method, involves depositing semiconductor function layer over surface of semiconductor substrate to form membrane region over cavern and connection forming region beside cavern

摘要

The method involves providing a semiconductor substrate (1), and providing a cavern (12a) in a surface (OF) of the semiconductor substrate. A semiconductor function layer (15) is deposited over the surface of the semiconductor substrate to form a membrane region (MB) over the cavern and a connection forming region (CC) beside the cavern. The cavern is produced by forming a mask on the surface of the semiconductor substrate and by providing a doping grid on the surface of the semiconductor substrate. Independent claims are also included for the following: (1) a micro-electro-mechanical system (MEMS) substrate comprising a semiconductor substrate and a cavern (2) a micro-electro-mechanical system (MEMS) process under application of a micro-electro-mechanical system (MEMS) substrate.