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Burn-in sockets for BGA IC devices having an integrated slider with full ball grid compatibility
Burn-in sockets for BGA IC devices having an integrated slider with full ball grid compatibility
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机译:用于BGA IC器件的老化插座,具有集成的滑块,具有完全的球栅兼容性
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摘要
A slider 24 that integrates adaptor alignment and anti-stick features is shown for use in a socket for mounting BGA type IC devices for burn-in tests. Slider 24 has a top wall surface 14b formed with a plurality of apertures in a grid array defined by intersecting ribs 14e, 14f. A plurality of wall extension portions 14h are formed extending upwardly from portions of x-direction ribs that serve as fine alignment features with an IC device 2 adapted to be placed on the flat top end surface of the wall extension portions between rows of IC device solder ball terminals 2a. Anti-stick fingers 24c extend in the x-direction from wall extension portions 24b along a y-direction rib defining the outer limit of the first column 14s of apertures of the main grid. A concave surface 24d is formed in each finger facing wall portions 24b and the height of wall portions 24b is limited to a location below the position of solder balls of an IC device mounted in the socket to provide clearance for a mechanical support ball positioned in the first column of apertures next to wall extension portion 24b outside the main grid field to provide full grid array capability.
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机译:显示了集成了适配器对齐和防粘功能的滑块 24 B>,该滑块用于安装BGA型IC器件以进行老化测试的插座中。滑块 24 B>具有顶壁表面 14 B> b I>,该顶壁表面形成有由相交的肋 14 B>限定的网格阵列中的多个孔B> e, I> 14 B> f I>。多个壁延伸部分 14 B> h I>形成为从x方向肋的一部分向上延伸,所述x方向肋用作与IC器件 2 B的精细对准特征。适于放置在成排的IC器件焊球端子 2 B> a I>之间的壁延伸部分的平坦顶端表面上。防粘手指 24 B> c I>从壁延伸部分 24 B> b I>沿y-方向沿x方向延伸。方向肋定义了主网格的第一列 14 B> s I>的外部界限。在每个面向手指的壁部 24 B> b I>中形成凹面 24 B> d I>,并且壁部的高度< B> 24 B> b I>限于在安装在插座中的IC器件的焊球位置下方的位置,以为位于下一个第一列孔中的机械支撑球提供间隙到主网格字段外部的墙扩展部分 24 B> b I>以提供完整的网格阵列功能。
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