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Semiconductor wafer processing apparatus and method for processing batch of wafers having variable number of wafer lots

机译:半导体晶片处理设备和用于处理一批晶片数量可变的晶片的方法

摘要

Disclosed is a semiconductor processing apparatus for processing batches of wafers with variable numbers of wafer lots. The apparatus includes an operator interface server adapted to receive batch information for a track-in operation, an equipment management server adapted to store data used to process the batch of wafers, and a device interface server adapted to control a selected unit of processing equipment used to process the batch of wafers. The batch information is transmitted from the operator interface server to the device interface server, and the device interface server attempts to set a sub-recipe in the selected unit of processing equipment based on the batch information. After the sub-recipe is set in the selected unit of processing equipment, the device interface server then attempts to set a process recipe in the device interface server.
机译:公开了一种用于处理一批晶片数量可变的晶片的半导体处理装置。该设备包括适于接收用于跟踪操作的批处理信息的操作员接口服务器,适于存储用于处理一批晶片的数据的设备管理服务器,以及适于控制所使用的处理设备的选定单元的设备接口服务器。处理一批晶圆。批处理信息从操作员接口服务器传输到设备接口服务器,并且设备接口服务器尝试基于批处理信息在所选的处理设备单位中设置子配方。在所选的处理设备单位中设置了子配方后,设备接口服务器将尝试在设备接口服务器中设置过程配方。

著录项

  • 公开/公告号US7353078B2

    专利类型

  • 公开/公告日2008-04-01

    原文格式PDF

  • 申请/专利权人 JAE-WOO CHUNG;JUN JUNG;

    申请/专利号US20060474385

  • 发明设计人 JAE-WOO CHUNG;JUN JUNG;

    申请日2006-06-26

  • 分类号G06F19/00;

  • 国家 US

  • 入库时间 2022-08-21 20:09:32

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