A PROCESS FOR THE FABRICATION OF IMPROVED CONDUCTOR FOR POWER THICK FILM HYBRID MICROCIRCUITS /MICROWAVE INTEGRATED CIRCUITS(PHMC)

摘要

A process for the fabrication of improved conductor for power thick film hybrid microcircuits/microwave integrated circuits by preparing known thick film conductors selected from Pd-Ag, Pt-Ag, Pd-Pt-Ag on thick film circuits by conventional methods; surface cleaning the thick film conductor paths obtained by known methods; shorting the conductor paths by known means; electroplating the conductors with copper in a standard conventional electroplating bath to grow a desired plating thickness of 4µm; removing shorting done from conductor paths; cleaning the resultant copper plated conductor paths on thick film substrate in distilled water.