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Plating lead evaluation program, the evaluation device comprising a computer-readable recording medium recording the plating lead evaluation program, and the printed wiring board has been designed by using these plating lead evaluation program or evaluation device
Plating lead evaluation program, the evaluation device comprising a computer-readable recording medium recording the plating lead evaluation program, and the printed wiring board has been designed by using these plating lead evaluation program or evaluation device
PROBLEM TO BE SOLVED: To provide a design method for a printed circuit board capable of contributing to improvement of reliability and quality of a product, to provide a plated lead evaluation program for realizing the design method, to provide an evaluation device with a computer-readable recording medium recording the plated lead evaluation program, and to provide the printed circuit board designed by use of the design method, plated lead evaluation program or evaluation device.;SOLUTION: This printed circuit board is obtained by executing: a process (step S1) for setting a value of conductive resistance of a plated lead electrically connecting a conductor to be plated and a plating current supply source on the basis of a design drawing of a drawing-around pattern of the plated lead; a process (step S2) for evaluating the value of the conductive resistance; a process (step S3) for deciding whether a laying-around path of the plated lead is incompatible or not, on the basis of an evaluation resu and a process (step 4) for changing the laying-around path of the plated lead when deciding that it is incompatible.;COPYRIGHT: (C)2005,JPO&NCIPI
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