RESIN COMPOSITION FOR DIELECTRIC HEAT-ADJUSTING, HOT-MELT ADHESIVE, ADHESIVE METHOD FOR ADHESIVE MATERIAL, ADHESIVE RESIN COMPOSITION AND ADHESIVE COMPOSITE USED AS A HOT-MELT ADHESIVE ADHESIVE

摘要

PPROBLEM TO BE SOLVED: To obtain a resin composition for dielectric heating adhesion, heat melted by charging high-frequency voltage for very short time and maintaining excellent adhesive strengths at remarkably high temperatures. PSOLUTION: This resin composition for the dielectric heating adhesion comprises a polyolefin-based resin having 80-200C melting point and an electroconductive material having 10SP-2/SP.cm volume resistivity, and contains 1-30 volume % electroconductive material based on the whole resin composition and has 0.03 dielectric tangent at 40 MHz frequency. The dielectric tangent at 40 MHz frequency of the resin composition for dielectric heating adhesion is preferably 0.1. The volume resistivity of the electroconductive material is preferably 10SP-4/SP.cm. PCOPYRIGHT: (C)2003,JPO