首页> 美国政府科技报告 >Development of a Dielectric Based Non-Destructive Examination Method for Adhesive Bonded Structures: A Fundamental Study. Investigation of Dielectric Methods for the Characterization of Adhesive Bonded Structures
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Development of a Dielectric Based Non-Destructive Examination Method for Adhesive Bonded Structures: A Fundamental Study. Investigation of Dielectric Methods for the Characterization of Adhesive Bonded Structures

机译:基于介电的粘接剂结构无损检测方法的发展:一项基础研究。粘接剂结构表征的介电方法研究

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The report covers work carried out by students at the University of Strathclyde evaluating the application of the dielectric technique to the characterisation of ageing in adhesive bonded structures. The work covers studies of aluminium-epoxy-aluminium and carbon fibre-epoxy-carbon fibre. The ageing in these structures was induced by exposing samples to high humidity and elevated temperatures and revealed the possible correlations between the changes in dielectric property and changes in mechanical property in the joints. This study has established the potential of applying the dielectric technique for the non-destructive analysis of adhesive bonded structures.

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