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Semiconductor module in which a semiconductor package is bonded on a mount substrate
Semiconductor module in which a semiconductor package is bonded on a mount substrate
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机译:半导体模块,在该半导体模块中,半导体封装件被接合在安装基板上
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摘要
A semiconductor module comprises: semiconductor packages each comprising a semiconductor element, a wiring substrate having a wiring member connected to the semiconductor element and external terminals connected to the wiring member, and a first organic film formed on a side of the semiconductor element opposed to a side toward the wiring substrate; and a mount substrate, on which the semiconductor element is mounted. First of the semiconductor packages and second of the semiconductor packages are stacked. Second organic films are provided between the wiring substrate of the first semiconductor package and the first organic film of the second semiconductor package and between the mount substrate and the semiconductor package.
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