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Flip-chip packaging process using copper pillar as bump structure
Flip-chip packaging process using copper pillar as bump structure
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机译:以铜柱为凸点结构的倒装芯片封装工艺
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摘要
A flip-chip packaging process is disclosed. The present invention is featured in forming a copper pillar on a wafer, forming a solder on a substrate; and enabling the solder to substantially cover the entire externally-exposed surface of the copper pillar, thereby connecting the copper pillar to the substrate. The copper pillar of the present invention can be such as a prism or a cylinder.
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