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Test structures and method of defect detection using voltage contrast inspection

机译:使用电压对比检查进行缺陷检测的测试结构和方法

摘要

Test structures and a method for voltage contrast (VC) inspection are disclosed. In one embodiment, the test structure includes: a gate stack that is grounded by a ground to maintain the gate stack in an off state during VC inspection, which allows NFET defect detection using VC inspection prior to contact dielectric deposition. The test structure may alternatively include a gate stack that is biased by a bias to maintain the gate stack in an on state during VC inspection. The method may detect source-to-drain shorts in a transistor using VC inspection by providing a gate stack over a source and drain region of the transistor that is grounded by a ground to maintain the gate stack in an off state during VC inspection; and inspecting the transistor using voltage contrast. If the drain of the NFET brightens during VC inspection, this indicates a source to drain short.
机译:公开了用于电压对比(VC)检查的测试结构和方法。在一个实施例中,测试结构包括:栅叠层,其通过接地接地以在VC检查期间将栅叠层保持在截止状态,这允许在接触电介质沉积之前使用VC检查来检测NFET缺陷。测试结构可替代地包括栅极堆叠,该栅极堆叠被偏压偏置以在VC检查期间将栅极堆叠维持在导通状态。该方法可以通过在通过接地接地的晶体管的源极和漏极区域上提供栅极叠层以在VC检查期间将栅极叠层保持在截止状态中来提供栅极叠层,从而使用VC检查来检测晶体管中的源极-漏极短路;并使用电压对比检查晶体管。如果在VC检查期间NFET的漏极变亮,则表明漏极的源极短路。

著录项

  • 公开/公告号US7456636B2

    专利类型

  • 公开/公告日2008-11-25

    原文格式PDF

  • 申请/专利权人 OLIVER D. PATTERSON;HUILONG ZHU;

    申请/专利号US20060308487

  • 发明设计人 OLIVER D. PATTERSON;HUILONG ZHU;

    申请日2006-03-29

  • 分类号G01R31/02;G01R31/26;H01L23/62;

  • 国家 US

  • 入库时间 2022-08-21 19:29:13

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