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Leadframe having heat sink supporting parts, a method of fabricating a light emitting diode package using the light emitting diode package and produced thereby
Leadframe having heat sink supporting parts, a method of fabricating a light emitting diode package using the light emitting diode package and produced thereby
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机译:具有散热器支撑部件的引线框架,使用该发光二极管封装的发光二极管封装的制造方法及其制造方法
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摘要
Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
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