For contacting which is suited for the flip chip assembly of the electronic parts the mannered null substrate which makes the connection possible

摘要

(57) Abstract The baseplate (1) the conducting structure which is provided on (3) the cover after (2) was made, the brazing and soldering possible membrane to which conducting structure (3) contacts with the pad (4) is formed is sealed up in the production method of the contact which is suited for the flip chip assembly of the SAW element which by the cover (2).