首页> 外国专利> Extensible robust modular electronic device without direct electrical connections for inter-module communication or control

Extensible robust modular electronic device without direct electrical connections for inter-module communication or control

机译:可扩展的坚固模块化电子设备,无需直接电连接即可进行模块间通信或控制

摘要

A modular electronic device where (predominantly) sealed modules are aligned and attached/connected in pre-determined sequences, forming a robust block-like structure with extendable function: Control and/or inter-module communication are implemented without direct electrical interconnect, by non-contact means such as (magnetic, inductive, light, infrared, radio frequency, sound, ultrasound, or other non-contact means). This device's inter-module power transfer may be with or without direct electrical contact, or devices may be internally powered. Power transfer through inductive/transformer action where one or more alignment pins are used as transformer core is one potential implementation. Modules may be liquid filled to facilitate cooling and/or crush resistance to high-pressure environments.
机译:模块化电子设备,其中(主要是)密封的模块按照预定的顺序对齐和连接/连接,从而形成具有可扩展功能的坚固的块状结构:实现控制和/或模块间通信而无需直接电互连-接触方式,例如(磁性,感应,光,红外线,射频,声音,超声或其他非接触方式)。该设备的模块间功率传输可以有或没有直接电接触,或者设备可以内部供电。一种潜在的实现方式是通过电感/变压器作用(其中一个或多个对准引脚用作变压器磁芯)进行功率传输。模块可以填充液体,以促进对高压环境的冷却和/或抗压性。

著录项

  • 公开/公告号US7727035B2

    专利类型

  • 公开/公告日2010-06-01

    原文格式PDF

  • 申请/专利权人 ROBERT JAMES RAPP;

    申请/专利号US20070986336

  • 发明设计人 ROBERT JAMES RAPP;

    申请日2007-11-20

  • 分类号H01R13/502;

  • 国家 US

  • 入库时间 2022-08-21 18:49:35

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